適用于復合材料、半導體材料、石材、石墨、陶瓷、水晶、玉石、玻璃等硬質材料的切磨加工，具有加工效率高、精度高、磨損小的特點。 Used for cutting and grinding composite materials,semiconductor materials,stone, graphite,ceramic,crystal,jade,glass and other hard materials.With the characterics of high processing efficiency,high precision,less wear.